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NSR0520V2, NSVR0520V2
http://onsemi.com
4
PACKAGE DIMENSIONS
SOD?523
CASE 502
ISSUE E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO-
TRUSIONS, OR GATE BURRS.
E
D
?X?
?Y?
2X
b
0.08
M
X
Y
A
HE
c
DIM MIN NOM MAX
MILLIMETERS
D
1.10 1.20 1.30
E
0.70 0.80 0.90
A
0.50 0.60 0.70
b
0.25 0.30 0.35
c
0.07 0.14 0.20
L
0.30 REF
HE
1.50 1.60 1.70
12
*For additional information on our Pb?Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
RECOMMENDED
TOP VIEW
SIDE VIEW
2X
L2
BOTTOM VIEW
2X
L
2X
0.48
2X
0.40
1.80
DIMENSION: MILLIMETERS
PACKAGE
OUTLINE
L2
0.15 0.20 0.25
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